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 0.11 ultra-low leakage

 overview

csmc 0.11 ull process uses aluminum interconnects, 1p8m architecture, offering 1.5v core device and 3.3v i/o device with ultra-low-leakage features, typical ioff (pa/um)<0.5.

 key features 
- single poly, eight-metal-layer process
- al backend with low-k fsg material
- device ioff (typical) <0.5 pa/um

 applications
- mcu
- iot

 0.11 ull flash 

 overview

csmc 0.11 ull flash process technology is embedded flash based on 0.11 ull, core device is compatible with ull process, offering ultra-low power analog ip.

 key features
- double poly, eight-metal-layer process
- al backend with low-k fsg material
- competitive flash macro cell size

 application 
- mcu
- iot